According to a new report from Intel Market Research, the global Advanced Packaging System Market was valued at USD 14,650 million in 2024 and is projected to reach USD 19,230 million by 2034, growing at a steady CAGR of 4.1% during the forecast period (2025–2034). Growth is driven by increasing demand for compact, high-performance electronics across industries such as automotive,...

Global Wafer Grinding Services Market is experiencing robust growth, propelled by the accelerating demand for ultra‑thin wafers in advanced packaging, automotive electronics, and data‑center semiconductor applications. Industry analysts forecast a sustained upward trajectory through 2034 as manufacturers intensify wafer thinning and back‑grinding activities to meet the challenges of...